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Topics include encapsulation technologies for wearables, e-textiles, biochemical monitoring platforms.
August 3, 2018
By: DAVID SAVASTANO
Editor, Ink World Magazine
NextFlex’s Project Call 4.0 (PC 4.0) is scheduled for release on Monday, Aug. 6, 2018. Here’s what’s in store: PC 4.0 will continue to focus on the areas identified in the Flexible Hyrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and academic subject matter experts, and reviewed by the Institute’s Technical and Governing Councils. Topics for this latest project call have a diverse scope that repr...
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